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general features applications part numbering splitter ci p 21 t 901 ne 1 2 3 4 5 6 7 splitter series 2 - dividing local power in a mobile phone. splitter is used for dividing local power in a mobile phone . it is positioned ahead of vco output and sends the local power to rx/tx parts separately. output signals have mutually the same phase and amplitude. -available in the 700mhz to 1.9ghz frequency range. - low loss and high isolation - ultra-small size and lightweight smds. - available in tape and reel packings for automatic mounting. - operating temperature: -35 to +85 - recommended matching capacitor : 3pf for cip21t701ne : 2pf for cip21(or 31)t901ne : 1pf for cip21(or 31)t182ne - reflow soldering available. code description of code p chip splitter 1 abbreviation of splitter 2 series 3 dimension 4 material 5 frequency band for application 6 thickness option
splitter dimension 3 material 4 frequency band for application 5 thickness option 6 code l w t 21 2.0 0.2 1.25 0.2 1.0 0.2 31 3.2 0.2 1.60 0.2 1.0 0.2 code description of code t material for high frequency frequency band is identified by 3 digits. the first and second digits identify the first and second significant figures of the frequency. the third digit identified the multiplier example) 901 : 90 101 = 900mhz 182 : 18 102 = 1800mhz code description of code n standard thickness a thinner than standard thickness b thicker than standard thickness
splitter appearance and dimenson :in (sum port) :out-1 :out-2 p a l t w b code dimension ( mm ) l w t a b p 21 2.0 0.2 1.25 0.2 1.0 0.2 0.3+0.2/-0.1 0.2 0.1 0.65 0.05 31 3.2 0.2 1.60 0.2 1.0 0.2 0.4 0.2 0.45 0.2 0.95 0.1
splitter caracteristic line up 901 : 90x10 1 = 900mhz 182 : 18x10 2 = 1800mhz 1.0mm 2.0x1.2mm 1.3 23db 0.3db CIP21T182NE 1.0mm 2.0x1.2mm 1.3 23db 0.3db cip21t901ne 1.0mm 3.2x1.6mm 1.3 23db 0.3db cip31t182ne 1.0mm 3.2x1.6mm 1.3 23db 0.3db cip31t901ne thickness dimension vswr isolation insertion loss product
reliability test condition splitter no item condition specification 1 thermal shock temp. cycle of the following be subject for 100cycles. -40 ,30min ? +85 ,30min electrical characteristics shall be satisfied. 2 humidity resistance +40 3 , relative humidity 90~95% for 1000hours. electrical characteristics shall be satisfied. 3 high temperature resistance +125 3 for 1000hours. electrical characteristics shall be satisfied. 4 low temperature resistance -40 3 for 1000hours. electrical characteristics shall be satisfied. 5 solderability soldering temp.: 245 5 immersion time: 4 1sec. at least 90% of the termination on each should be covered with solder. 6 resistance to soldering heat preheat : 100~130 , 60~120sec peak temperature : 250 max. specimens are soldered twice with the above condition then kept in room temperature and humidity for 24 hours before measurements. temperature profile is as below electrical characteristics shall be satisfied. without distinct deformation in appearance. t 150 soldering temp 220 30~50 sec preheating temp 60 60~120 6 preheating soldering cooling time (sec) temp 250 temperature profile
splitter block diagram frequency separator in dual band phone coupler driver amp. isolator saw duplexer apc pam balun vco lna lna ? ? bpf bpf rx tx cdma/pcs splitter
splitter application manual stage precaution technical consideration 1. soldering 2. cleaning ? soldering 1. temperature, time, amount of solder, etc. are specified in accordance with the following recommended conditions. ? cleaning conditions 1. when cleaning the pc board after the splitters are all mounted, select the appropriate cleaning solution according to the type of flux used and purpose of the cleaning(e.g. to remove soldering flux or other materials from the production process.) 2. cleaning conditions should be determined after verifying, through a test run, that the cleaning process does not affect the splitter's characteristics. 1-1. preheating when soldering heating : splitter should be preheated within 100 to 130 of the soldering. cooling : the temperature difference between the components and cleaning process should not be greater than 100 . splitter is susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. therefore, the soldering process must be conducted with a great care so as to prevent malfunction of the components due to excessive thermal shock.. recommended conditions for soldering [reflow soldering] temperature profile t 150 soldering temp 220 30~50 sec preheating temp 60 60~120 6 preheating soldering cooling time (sec) temp 250 1. the ideal condition is to have solder mass (f illet) controlled to 1/2 to 1/3 of the thickness of the splitter, as shown below: 2. because excessive dwell times can detrimentally affect solderability, soldering duration s hould be kept as close to recommended times as possible. 1. the use of inappropriate solutions can cause foreign substances such as flux residue to adhere to the splitter, resulting in a degradation of the splitter's electrical properties (especially insulation resistance). 2. inappropriate cleaning conditions (insufficient or excessive cleaning) may detrimentally affect the performance of the splitters. (1)excessive cleaning in the case of ultrasonic cleaning, too much power output can cause excessive vibration of the pc board which may lead to the cracking of the splitter or the soldered portion, or decrease the terminal electrodes' strength. thus the following conditions should be carefully checked; ultrasonic output below 20 w/l ultrasonic frequency below 40 khz ultrasonic washing period 5 min. or less splitter t 1/2t 1/3t solder pc board
splitter stage precaution technical consideration 3. post cleaning processes 4. storage conditions ? application of resin coatings, molding, etc. to the pcb and components. 1. with some type of resins a decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while left under normal storage conditions resulting in the deterioration of the splitter's performance. 2. when a resin's hardening temperature is higher than the splitter's operating temperature, the stresses generated by the excess heat may lead to splitter damage or destruction. 3. stress caused by a resin's temperature generated expansion and contraction may damage splitters the use of such resins, molding materials etc. is not recommended. ? storage 1. to maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control temperature and humidity in the storage area. humidity should especially be kept as low as possible. recommended conditions ambient temperature below 40 humidity below 70% rh the ambient temperature must be kept below 30 . even under ideal storage conditions splitter electrode solderability decreases as time passes, so splitters should be used within 6 months from the time of delivery. the packaging material should be kept where no chlorine or sulfur exists in the air 1. if the parts are stocked in a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes and deterioration of taping/packaging materials may take place. for this reason, components should be used within 6 months from the time of delivery. if exceeding the above period, please check solderability before using the splitters
embossed plastic tape splitter packaging quantity 2 0.05 [ .079 .002 ] 40.1[.157.004] 1.5 [.059 ] +0.1 -0 +.004 -0 a b 80.3 .315.012 1.750.1 .069.004 3.50.05 .138.002 0.3 [0.012] t embossed tape type tape material a b t tc (chip thickness) 21 embossed tape 1.5 0.2 [.059 .008] 2.3 0.2 [.091 .008] 2.0 [.079] 1.0 0.2 31 embossed tape 2.0 0.2 [.079 .008] 3.6 0.2 [.142 .008] 2.0 [.079] 1.0 0.2 unit : mm type thickness of body[mm] standard quantity[pcs] 21 1.0 3000 31 1.0 3000
splitter reel dimension e c d r a w b t a b c d e w t r 178 2 60 5.0 13 0.5 21 0.8 2 0.5 10.0 1.5 0.8 0.2 1.0 unit:mm
splitter report before change notice if it is required to change the specifications, materials or manufacturing methods of this specified baluns, we shall inform on written statement with its quality and reliability data before changes may occur. packaging restriction of environmen tal destructive material usage of destructive ma terials to ozonosphere package includes label with below item and outgoing inspection data on customer's request. - part no.& lot no. - quantity - name and logo of manufacturer baluns specified on this specification do not use any of under stated materials. cd, hg, as, br and its chemical composite, pcb and asbestos. pbbs pbbos pbdo pbde pbb cbaluns specified on this specification do not use any of under stated ods materials on its manufacturing stages. freon haron 1-1-1 tce ccl4 hcfc

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